PC28F256P33BFE

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PC28F256P33BFE

+BOM

IC FLASH 256MBIT PAR 64EASYBGA

  • ManufacturerMicron Technology Inc.

  • Mfr. Part #PC28F256P33BFE

  • In Stock2694

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Specifications

Attribute Value
Series Axcell™
Part Status Obsolete
Base Product Number PC28F256
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 16M x 16
Memory Interface Parallel
Clock Frequency 52 MHz
Write Cycle Time - Word, Page 95ns
Voltage - Supply 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC)
Mounting Type Surface Mount
Package 64-TBGA
Supplier Device Package 64-EasyBGA (8x10)
Packaging Tray
Access Time 95 ns

Overview

Description

The PC28F256P33BFE is a flash memory device developed by Intel, designed for various electronic applications requiring non-volatile storage. It is part of the Intel StrataFlash® series, renowned for its reliability and performance in storing large amounts of data. This specific model offers a storage capacity of 256 megabits, which is equivalent to 32 megabytes.
Key features of the PC28F256P33BFE include high-speed read and write operations, enhanced security features, and low power consumption, making it suitable for mobile and embedded systems. The device operates on a 3.3V power supply, aligning with industry standards for low power requirements.
It utilizes a NOR flash architecture, known for fast read speeds and the ability to execute code directly from the flash memory, which is beneficial for applications that require quick data access and execution. The PC28F256P33BFE also supports multiple programming and erase cycles, ensuring durability and longevity in various environments.
Overall, the PC28F256P33BFE is a versatile and efficient choice for developers needing reliable and high-performance flash memory solutions.

Equivalent

Equivalent products to the Intel PC28F256P33BFE chip, a 256Mb P33 flash memory, could include similar high-density parallel NOR flash memory chips from other manufacturers like Micron, Winbond, or Cypress. Models such as the Micron MT28EW256ABA or similar variants from these manufacturers with comparable specifications in terms of density, voltage, and package might serve as alternatives. Be sure to verify the pinout and electrical characteristics for compatibility in your specific application.

Features

The PC28F256P33BFE is a 256 Mb (megabit) NOR Flash memory chip from Intel, part of the StrataFlash® Memory P33 family. Key features include:
1. Architecture: It utilizes multilevel cell (MLC) technology for higher density and cost-effective storage solutions.
2. Interface: Supports Asynchronous Page Mode and Synchronous Burst Mode, providing flexibility and faster data access.
3. Voltage Range: Operates at a core voltage of 1.8V with I/O options of 1.8V, 2.5V, or 3.0V, suitable for power-sensitive applications.
4. Performance: Offers fast read speeds up to 66 MHz in burst mode and reduced power consumption for mobile and embedded applications.
5. Security Features: Includes password protection and a locking mechanism to prevent unauthorized access.
6. Erase/Program Cycles: Supports up to 100,000 program/erase cycles per block, ensuring durability and longevity.
7. Package Options: Available in various packages to support different design requirements.
These features make the PC28F256P33BFE ideal for applications demanding high-density, reliable, and energy-efficient memory solutions.

Pinout

The PC28F256P33BFE is a NOR-type Flash memory chip produced by Intel. It features a 64-ball easy BGA (Ball Grid Array) package. The chip provides a non-volatile storage solution with a capacity of 256 megabits (32 megabytes). The memory architecture is designed for high performance and reliability, suitable for various applications requiring code shadowing, execute-in-place (XIP), or data storage.
The pin functions typically include address lines, data lines, control signals (such as chip enable, output enable, and write enable), and power supply pins. The precise pin configuration and function for each ball in the BGA package are detailed in the manufacturer's datasheet, which provides a comprehensive depiction of the pin assignments and electrical characteristics needed for integration into electronic designs.

Manufacturer

The PC28F256P33BFE is a flash memory product manufactured by Intel Corporation. Intel is a multinational corporation headquartered in Santa Clara, California, primarily known for designing and manufacturing semiconductor chips, including microprocessors, flash memory, and other integrated circuits. The company plays a significant role in the technology industry as a leading provider of hardware components used in computers, servers, and various electronic devices.

Application

The PC28F256P33BFE is a high-density flash memory component often used in various electronic applications. Its application areas include consumer electronics, where it is utilized for data storage in devices like digital cameras, MP3 players, and smartphones. It is also employed in automotive systems for infotainment and control systems, offering reliable data retention and fast read/write speeds. In networking and telecommunications, it is used for firmware updates and configuration storage in routers and switches. Additionally, it finds applications in industrial systems for data logging and program storage, and in computing as a part of solid-state drives (SSDs) and other storage solutions due to its non-volatile memory characteristics.

Package

The PC28F256P33BFE is a NOR Flash memory part from Intel, packaged in a 56-lead Thin Small Outline Package (TSOP). This package type is compact, suitable for surface mounting on circuit boards, and aids in high-density memory applications.

Frequently Asked Questions


Q: What is the memory configuration and interface of the PC28F256P33BFE?
A: It is a 256Mbit NOR Flash with a 16M x 16 organization, utilizing a parallel memory interface for high-speed data transfer.


Q: What voltage range does this Micron Flash memory support?
A: It supports a supply voltage range of 2.3V to 3.6V, making it compatible with standard low-voltage digital systems.


Q: What is the typical access time and clock speed for this device?
A: The access time is 95 ns, and it supports a maximum clock frequency of 52 MHz for read operations.


Q: Is the PC28F256P33BFE suitable for industrial temperature environments?
A: Yes, it operates over a temperature range of -40°C to +85°C (TC), making it suitable for industrial applications.


Q: What package type does this component use for surface mounting?
A: It comes in a 64-TBGA package with a 64-EasyBGA (8x10) supplier device package, ideal for space-constrained designs.


Q: What is the write cycle time for word or page programming?
A: The write cycle time, including word and page programming, is rated at 95 ns, ensuring efficient data updates.


Q: Does this flash memory belong to the Axcell series from Micron?
A: Yes, it is part of the Axcell series, designed for high-performance non-volatile storage applications.


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