Images are for reference only
RF2713
+BOM-
ManufacturerQorvo
-
Mfr. Part #RF2713
-
In Stock19198
365 Days Quality Guarantee
7*24 hours service quarantee
90-day after-sales guarantee
Genuine Product Guarantee
Specifications
| Attribute | Value |
| Manufacturer | Qorvo |
| Package | SOP-14 |
Overview
Description
- Frequency Range: 50 MHz to 1000 MHz
- High Gain: Up to 20 dB
- Low Noise Figure: ~2.5 dB
- High Linearity (OIP3): ~40 dBm
- Supply Voltage: 5V (typical)
It is commonly used in cellular infrastructure, repeaters, and broadband systems due to its wide bandwidth and robust performance. The device is available in a surface-mount package (SOT-89), making it suitable for compact designs.
For detailed specifications, refer to the datasheet from the manufacturer.
Equivalent
- HMC441LP3 (Analog Devices)
- MGA-62563 (Avago/Broadcom)
- TGA2713 (Qorvo/Triquint)
- ERA-3SM+ (Mini-Circuits)
These alternatives offer comparable performance in RF amplification for applications like wireless communication and radar. Check datasheets for exact specs.
Features
- Frequency Range: 400–2700 MHz, suitable for cellular, broadband, and ISM applications.
- High Power Gain: Typically 16 dB at 900 MHz, ensuring efficient signal amplification.
- Output Power: Up to 25W (P1dB) at 28V, ideal for medium-power RF stages.
- High Efficiency: Typically 50% at 900 MHz, reducing power consumption.
- Supply Voltage: Operates at 12.5V or 28V, offering flexibility in design.
- Robust Package: Industry-standard SOT-502A (TO-270AA) package for reliable thermal performance.
- Wideband Matching: Internal input/output matching simplifies circuit design.
Applications include base stations, repeaters, and RF amplifiers. Its high gain, efficiency, and broadband performance make it a versatile choice for RF systems.
Pinout
- Pins 1, 16: RF input/output (balanced configuration).
- Pins 2, 15: Bias control (Vgg) for amplifier stages.
- Pins 3, 14: Ground (GND).
- Pins 4, 5, 12, 13: Power supply (Vdd) for amplification stages.
- Pins 6–11: NC (No Connection) or reserved for thermal/mechanical stability.
It delivers ~1W output power with high gain (~30 dB) and is commonly used in cellular and wireless communication systems. The package is typically a 16-pin SOIC (Surface-Mount).