SLE952500000XTSA1

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SLE952500000XTSA1

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IC EMB AUTHENTICATION 6TSNP

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Specifications

Attribute Value
Package / Case Bulk
Series OPTIGA™ Trust B
Part Status Discontinued at Digi-Key
Applications Security
Interface SWI
Number of I/O 1
Voltage - Supply 1.35V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount

Overview

Description

The SLE952500000XTSA1 is a secure element (SE) chip from Infineon Technologies, designed for embedded security applications. It provides tamper-resistant hardware for secure storage and cryptographic operations, commonly used in IoT devices, payment systems, and authentication solutions.
Key features:
- CC EAL 5+ certified for high security.
- Supports AES, RSA, ECC, and SHA algorithms.
- Low power consumption, suitable for battery-powered devices.
- I²C and SPI interfaces for easy integration.
Applications include smart cards, industrial IoT, and trusted platform modules (TPMs). Its compact form factor (e.g., TSSOP-14 package) makes it ideal for space-constrained designs.
For detailed specs, refer to Infineon’s datasheet.

Equivalent

The SLE952500000XTSA1 is a secure authentication chip from Infineon. Equivalent products include:
- Microchip ATECC608A (Secure Element)
- NXP A71CH (Secure Authentication IC)
- STMicroelectronics STSAFE-A110 (Secure Element)
- Maxim Integrated DS28E38 (DeepCover Authenticator)
These alternatives offer similar security features like ECC-based authentication, tamper resistance, and secure key storage. Choose based on compatibility and specific application needs.

Application

The SLE952500000XTSA1 is a secure element chip primarily used in:
- Smart Cards: Banking, ID, and access control.
- IoT Security: Device authentication and data protection.
- Automotive: Secure keyless entry and V2X communication.
- Mobile Payments: NFC transactions (e.g., digital wallets).
- Industrial: Secure firmware updates and anti-counterfeiting.
It ensures tamper-resistant storage, encryption, and secure transactions.

Package

The SLE952500000XTSA1 is a SOT23-6 package type, commonly used for small surface-mount ICs like EEPROMs. It features six pins in a compact, low-profile design, suitable for space-constrained applications. The package dimensions are approximately 2.9mm x 1.6mm x 1.1mm. It is widely used in automotive, industrial, and consumer electronics for reliable non-volatile memory storage.

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