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TDA21470
+BOMIC CONTROLLER
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ManufacturerInfineon Technologies
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Mfr. Part #TDA21470
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In Stock6491
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Specifications
| Attribute | Value |
| PartStatus | Obsolete |
| BaseProductNumber | TDA21470 |
| Packaging | Bulk |
Overview
Description
Key features of the TDA21470 include:
1. High current capability, supporting up to 70A.
2. Enhanced thermal performance due to the embedded driver and optimized package design.
3. Excellent switching characteristics, allowing for fast and efficient operation.
4. Integration of various protection features like over-temperature and short-circuit protection.
The TDA21470 is particularly suitable for applications requiring high power density and efficiency, such as voltage regulation modules (VRMs) in servers, storage systems, and high-performance computing platforms. Its compact design and robust performance make it ideal for modern power management solutions.
Equivalent
1. Texas Instruments CSD95379Q3M
2. ON Semiconductor FDMF3170
3. Vishay Siliconix SiC620R
4. Renesas RAA220001
These alternatives provide similar functionalities in terms of integration, efficiency, and thermal performance for high-current applications. Always verify compatibility with your specific application requirements.
Features
1. Integration: Combines a driver IC, high-side, and low-side MOSFETs in a single package for efficient power management.
2. Efficiency: Optimizes power conversion efficiency, crucial for minimizing energy losses in high-performance systems.
3. Current Rating: Supports high current output, typically suitable for advanced computing needs like servers and data centers.
4. Thermal Performance: Enhanced thermal management capabilities to ensure reliable operation under demanding conditions.
5. Switching Frequency: Offers high switching frequency capabilities, enabling compact design and improved transient response.
6. Protection Features: Includes various protection mechanisms such as over-current, over-voltage, and thermal protection to ensure safety and reliability.
7. EMI Performance: Designed to minimize electromagnetic interference, contributing to stable operation in sensitive environments.
These features make the TDA21470 suitable for applications requiring high power density, efficiency, and reliability.
Pinout
The TDA21470 comes in a package with a pin count that may vary depending on the specific design and application, but it commonly features a standard power stage footprint with around 5 to 7 pins, including:
1. VIN: Input voltage supply.
2. VOUT: Output voltage.
3. GND: Ground connection.
4. PWM: Pulse Width Modulation input for controlling the MOSFETs.
5. BOOT: Bootstrap pin for the high-side driver.
6. SW: Switching node connecting the high-side and low-side MOSFETs.
These pins work together to facilitate efficient power conversion in various electronic devices. Always refer to the specific datasheet for detailed pin configuration and electrical characteristics.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the lifecycle status of the TDA21470?
A: The TDA21470 is marked as Obsolete; it is recommended to verify long-term availability or consider alternative solutions.
Q: Is the TDA21470 suitable for new designs?
A: No, due to its Obsolete status, this device is not recommended for new designs or high-volume production.
Q: What is the packaging type for this part?
A: The TDA21470 is supplied in Bulk packaging, suitable for prototyping or low-volume assembly.
Q: Can I get technical support or datasheets for this Obsolete part?
A: Yes, consult the Base Product Number TDA21470 for archived datasheets, though official support may be limited.
Q: Are there any RoHS compliance details provided?
A: No, RoHS information is not specified in the parameters; verify with the manufacturer or distributor before use.
Q: What application scenarios is the TDA21470 designed for?
A: As an Infineon semiconductor, it likely targets power management or driver IC applications; however, exact use cases require a datasheet review.