TMS320C6455BCTZA

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TMS320C6455BCTZA

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IC DSP FIXED-POINT 697FCBGA

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Specifications

Attribute Value
Package / Case Tray
Series TMS320C645x
Part Status Active
Type Fixed Point
Interface Host Interface, I²C, McBSP, PCI, UTOPIA
Clock Rate 1GHz
Non - Volatile Memory ROM (32kB)
On - Chip RAM 2.1MB
Voltage - I / O 1.8V, 3.3V
Voltage - Core 1.25V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount

Overview

Equivalent

The TMS320C6455BCTZA is a high-performance DSP from Texas Instruments. Equivalent or similar products include:
- TMS320C6455BZTZ: Same DSP with different packaging.
- TMS320C6457: Higher performance variant.
- TMS320C6474: Multicore alternative.
- TMS320C6678: More advanced, multicore DSP.
For modern replacements, consider TMS320C66x or Keystone series DSPs. Check TI's website for exact compatibility.

Pinout

The TMS320C6455BCTZA is a DSP from Texas Instruments with the following key details:
- Pin Count: 697 pins (FCBGA package)
- Core: 1.2 GHz C64x+ DSP
- Memory: 2 MB L2 cache, supports DDR2 SDRAM
- Interfaces:
- EMIF (External Memory Interface)
- PCI (Peripheral Component Interconnect)
- McBSP (Multichannel Buffered Serial Port)
- EMAC (Ethernet MAC)
- HPI (Host Port Interface)
- GPIO (General-Purpose I/O)
- Power: 1.2V core, 3.3V I/O
Designed for high-performance applications like telecom, imaging, and networking.

Manufacturer

The TMS320C6455BCTZA is manufactured by Texas Instruments (TI), a leading American semiconductor company. TI specializes in designing and producing analog and digital integrated circuits (ICs), including microcontrollers, digital signal processors (DSPs), and other embedded solutions. The TMS320C6455BCTZA is part of TI's TMS320C6000 DSP family, known for high-performance signal processing applications in telecommunications, medical imaging, and industrial systems.
Founded in 1930, TI is a Fortune 500 company headquartered in Dallas, Texas, and is a key player in the global semiconductor industry.

Application

The TMS320C6455BCTZA, a high-performance DSP from Texas Instruments, is used in:
1. Telecommunications – Base stations, VoIP, and wireless infrastructure.
2. Medical Imaging – Ultrasound, MRI, and CT scan processing.
3. Defense & Aerospace – Radar, sonar, and signal intelligence.
4. Industrial Automation – Real-time control and machine vision.
5. Video Processing – High-resolution video analytics and surveillance.
Its 1 GHz clock speed, high-speed interfaces (SRIO, EMIF), and multicore support make it ideal for compute-intensive applications.

Package

The TMS320C6455BCTZA is packaged in a 361-ball BGA (Ball Grid Array) with a 0.8 mm ball pitch. The package type is BGA (PBGA)—Plastic Ball Grid Array—designed for high-performance DSP applications, offering robust thermal and electrical performance. The "CTZA" suffix indicates the specific package variant.

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