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UPD5750T7D-E4A-A
+BOMRF/MICROWAVE AMPLIFIER, BICMOS
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ManufacturerRenesas Electronics America Inc
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Mfr. Part #UPD5750T7D-E4A-A
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Datasheet UPD5750T7D-E4A-A DataSheet
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Package 6-XFBGA
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In Stock6574
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Specifications
| Attribute | Value |
| Supplier | Rochester Electronics, LLC |
| Package | Bulk |
| ProductStatus | Obsolete |
| Frequency | 50MHz ~ 1.8GHz |
| P1dB | -12dBm |
| Gain | 13.5dB |
| NoiseFigure | 1.5dB |
| Voltage-Supply | 1.6V ~ 2V |
| Current-Supply | 3.1mA |
| TestFrequency | 470MHz |
| MountingType | Surface Mount |
| Package/Case | 6-XFBGA |
Overview
Description
The key features of the UPD5750T7D-E4A-A include low power consumption, a wide frequency range, and excellent linearity, making it suitable for various communication technologies. Its compact design allows for easy integration into small and portable devices. Additionally, the device offers high isolation and low insertion loss, which contribute to minimizing signal interference and maximizing efficiency.
It typically comes in a small package that is conducive to space-constrained applications, making it ideal for both consumer electronics and industrial devices. The UPD5750T7D-E4A-A is used in circuits where precise signal amplification and control are crucial for maintaining high-quality communication standards.
Equivalent
Features
1. Frequency Range: It operates over a wide frequency range, typically from 50 MHz to 2.7 GHz, making it suitable for multiple communication standards.
2. High Isolation and Low Insertion Loss: It offers excellent isolation and low insertion loss, ensuring minimal signal degradation and effective separation between different signal paths.
3. Control Voltage: It is typically controlled using a single positive voltage, which simplifies integration into designs.
4. Compact Package: The device is available in a compact package, often a small lead-free or RoHS-compliant package, facilitating easy integration into space-constrained designs.
5. Reliability: Designed to operate reliably over a wide temperature range, making it suitable for various environmental conditions.
6. Applications: Ideal for use in mobile communications, wireless LANs, and other RF switching applications that require efficient signal routing.
This switch is noted for its robust performance, contributing to improved system reliability and efficiency in RF applications.
Pinout
As for its pin count and function:
- Pin Count: The UPD5750T7D-E4A-A comes in a small TSSOP (Thin Shrink Small Outline Package) package, typically having 20 pins. However, for the exact pin count and configuration, referring to the official datasheet is recommended.
- Function: This IC is primarily used for switching RF signals. It is designed to manage multiple RF signal paths, making it suitable for applications in wireless communications where signal routing is necessary, such as in antennas or multi-band devices. The component's high isolation and low insertion loss characteristics make it efficient for maintaining signal integrity in RF applications.
For detailed specifications and an accurate pin configuration, consulting the manufacturer's datasheet is advisable.
Manufacturer
Application
1. Wireless Communication Equipment: Utilized in mobile phones, base stations, and wireless LAN devices for signal routing.
2. RF Systems: Applied in transceivers for directing RF signals between antennas and processing units.
3. Test and Measurement Instruments: Used in equipment that requires reliable RF signal switching for testing and calibration.
4. Satellite Communication: Implemented in switching RF signals for satellite transceivers.
5. Broadcasting Equipment: Employed in TV and radio broadcasting for managing frequency bands.
These applications take advantage of the IC's ability to handle high-frequency signals with low insertion loss and high isolation.