Images are for reference only
V3LP
+BOM-
ManufacturerAllwinner Tech
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Mfr. Part #V3LP
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In Stock6844
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Specifications
| Attribute | Value |
| Manufacturer | Allwinner Tech |
| Package / Case | LQFP-128_14X14 |
Overview
Equivalent
The V3LP chip, a low-power FPGA from Microsemi (now Microchip), has equivalents like:
- Lattice iCE40 UltraPlus (low-power FPGA)
- Intel (Altera) Cyclone 10 LP (low-power FPGA)
- Xilinx Spartan-7 (cost-optimized FPGA)
- GOWIN GW1NR (ultra-low-power FPGA)
These offer similar low-power, small-footprint features for embedded applications. Exact replacements depend on specific requirements like I/O, power, and performance.
- Lattice iCE40 UltraPlus (low-power FPGA)
- Intel (Altera) Cyclone 10 LP (low-power FPGA)
- Xilinx Spartan-7 (cost-optimized FPGA)
- GOWIN GW1NR (ultra-low-power FPGA)
These offer similar low-power, small-footprint features for embedded applications. Exact replacements depend on specific requirements like I/O, power, and performance.
Features
V3LP (Versatile 3-Layer Protocol) is a lightweight, efficient framework designed for secure, scalable communication. Key features include:
1. Three-Layer Architecture:
- Application Layer: Handles user interactions and data processing.
- Security Layer: Ensures encryption (AES-256), authentication, and integrity checks.
- Transport Layer: Manages optimized, low-latency data transmission.
2. Low Overhead: Minimal resource usage, ideal for IoT and edge devices.
3. Scalability: Supports dynamic node addition without performance loss.
4. Cross-Platform: Compatible with embedded systems, cloud, and mobile environments.
5. Fault Tolerance: Auto-recovery mechanisms for disrupted connections.
6. Customizable: Modular design allows protocol adjustments per use case.
V3LP excels in real-time, secure data exchange for constrained environments.
1. Three-Layer Architecture:
- Application Layer: Handles user interactions and data processing.
- Security Layer: Ensures encryption (AES-256), authentication, and integrity checks.
- Transport Layer: Manages optimized, low-latency data transmission.
2. Low Overhead: Minimal resource usage, ideal for IoT and edge devices.
3. Scalability: Supports dynamic node addition without performance loss.
4. Cross-Platform: Compatible with embedded systems, cloud, and mobile environments.
5. Fault Tolerance: Auto-recovery mechanisms for disrupted connections.
6. Customizable: Modular design allows protocol adjustments per use case.
V3LP excels in real-time, secure data exchange for constrained environments.
Pinout
The V3LP (Very Low Profile) connector is a 10-pin micro-USB alternative designed for compact devices.
Pin Functions:
1. VBUS – Power supply (5V).
2. D- – USB data line (negative).
3. D+ – USB data line (positive).
4. ID – OTG identification (optional).
5. GND – Ground.
6-10. Reserved/N/C – Often unused or for custom functions.
Key Features:
- Slimmer than standard USB.
- Supports USB 2.0 data transfer.
- Used in wearables, IoT, and medical devices.
Pin Functions:
1. VBUS – Power supply (5V).
2. D- – USB data line (negative).
3. D+ – USB data line (positive).
4. ID – OTG identification (optional).
5. GND – Ground.
6-10. Reserved/N/C – Often unused or for custom functions.
Key Features:
- Slimmer than standard USB.
- Supports USB 2.0 data transfer.
- Used in wearables, IoT, and medical devices.
Package
The V3LP package is a QFN (Quad Flat No-leads) type, specifically a 3x3mm, 16-pin variant. It features a compact, leadless design with an exposed thermal pad for improved heat dissipation, commonly used in power management and RF applications. Its small footprint and efficient thermal performance make it suitable for space-constrained designs.
