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XC3S1400A-4FT256I
+BOMIC FPGA 161 I/O 256FTBGA
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ManufacturerAMD
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Mfr. Part #XC3S1400A-4FT256I
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In Stock3239
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Specifications
| Attribute | Value |
| Series | Spartan®-3A |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 25344 |
| Total RAM Bits | 589824 |
| Number of I/O | 161 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC3S1400 |
| Number of LABs/CLBs | 2816 |
| Number of Gates | 1400000 |
Overview
Description
Equivalent
1. Altera (Intel) Cyclone II EP2C35 series
2. Lattice ECP2 series
3. Microsemi (Actel) ProASIC3 A3P1000 series
These alternatives offer similar performance and features in terms of logic elements, I/O pins, and general FPGA capabilities, though specific requirements and compatibility should be verified for each application.
Features
1. Logic Cells: It contains approximately 1.4 million system gates and 23,634 logic cells.
2. Package: The device is available in a 256-pin Fine-Pitch Ball Grid Array (FTBGA) package.
3. Performance: The device has a speed grade of -4, indicating a balanced trade-off between performance and power consumption.
4. I/O Pins: It offers 195 user I/O pins for versatile interfacing capabilities.
5. Block RAM: Includes up to 588 Kbits of block RAM for flexible data storage.
6. Digital Clock Managers (DCMs): Equipped with four DCMs for advanced clock management and signal synchronization.
7. Configuration: Supports various configuration modes, including JTAG and serial configuration.
8. Power: Designed for low power consumption, making it suitable for battery-powered applications.
9. Temperature Range: The 'I' in the part number signifies an industrial temperature range.
These features make the XC3S1400A-4FT256I suitable for a wide range of applications, including telecommunications, automotive, and consumer electronics.
Pinout
The primary function of the XC3S1400A is to serve as a field-programmable gate array (FPGA), which allows designers to configure its logic blocks and interconnects to perform a wide variety of tasks. These might include digital signal processing, protocol bridging, and custom logic implementations. The FPGA's resources, such as logic cells, block RAM, and I/O pins, are utilized to build specific digital circuits as required by the application.
In summary, the XC3S1400A-4FT256I has 256 pins and functions as a flexible and programmable logic solution suitable for a wide range of applications in digital electronics.
Manufacturer
Application
1. Consumer Electronics: Used in devices like HDTVs, set-top boxes, and gaming consoles.
2. Communications: Suitable for implementing protocol processing, data conversion, and network interfacing.
3. Automotive: Utilized in infotainment systems and driver assistance technologies.
4. Industrial Control: Employed in robotics, automation systems, and process control.
5. Medical Devices: Used for imaging systems and monitoring equipment.
6. Aerospace and Defense: Applied in avionics, radar systems, and signal processing.
These FPGAs are valued for their reconfigurability and ability to handle complex processing tasks efficiently.