Specifications
| Attribute | Value |
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 20340 |
| NumberofLogicElements/Cells | 355950 |
| TotalRAMBits | 31641600 |
| NumberofI/O | 280 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
Overview
Description
The XCKU3P-1FFVB676I is a member of Xilinx's (now AMD) Kintex UltraScale+ FPGA family, designed for high-performance applications. Key features include:
- FPGA Fabric: 16nm FinFET+ technology, offering high logic density and power efficiency.
- Logic Cells: ~1.1M (varies by configuration).
- DSP Slices: ~5,520 for high-speed signal processing.
- Memory: ~75.9 Mb of block RAM and UltraRAM for data-intensive tasks.
- I/O: Supports high-speed transceivers (up to 32.75 Gbps) and versatile I/O standards (LVDS, HSTL, etc.).
- Package: 676-pin flip-chip BGA (FFVB) for robust connectivity.
Applications:
- Data center acceleration, 5G, radar, and high-performance computing.
Tools:
- Supported by Vivado Design Suite for development.
This FPGA balances performance, power efficiency, and scalability, making it ideal for advanced embedded and compute workloads.
- FPGA Fabric: 16nm FinFET+ technology, offering high logic density and power efficiency.
- Logic Cells: ~1.1M (varies by configuration).
- DSP Slices: ~5,520 for high-speed signal processing.
- Memory: ~75.9 Mb of block RAM and UltraRAM for data-intensive tasks.
- I/O: Supports high-speed transceivers (up to 32.75 Gbps) and versatile I/O standards (LVDS, HSTL, etc.).
- Package: 676-pin flip-chip BGA (FFVB) for robust connectivity.
Applications:
- Data center acceleration, 5G, radar, and high-performance computing.
Tools:
- Supported by Vivado Design Suite for development.
This FPGA balances performance, power efficiency, and scalability, making it ideal for advanced embedded and compute workloads.
Equivalent
The XCKU3P-1FFVB676I is a Kintex UltraScale+ FPGA. Equivalent alternatives include:
- Xilinx Kintex UltraScale+ variants like XCKU3P-2FFVB676I (higher speed grade).
- AMD/Xilinx Versal (for newer designs, though not pin-compatible).
- Intel Stratix 10 (competitor, requires redesign).
For direct replacements, check same family (XCKU3P) with matching package (FFVB676) and speed grade. Always verify specs on official vendor resources.
- Xilinx Kintex UltraScale+ variants like XCKU3P-2FFVB676I (higher speed grade).
- AMD/Xilinx Versal (for newer designs, though not pin-compatible).
- Intel Stratix 10 (competitor, requires redesign).
For direct replacements, check same family (XCKU3P) with matching package (FFVB676) and speed grade. Always verify specs on official vendor resources.
Pinout
The XCKU3P-1FFVB676I is a Kintex UltraScale+ FPGA in a 676-pin flip-chip BGA package.
Key functions:
- High-speed I/O: Supports up to 32.75 Gb/s transceivers (GTH/GTY).
- Logic resources: ~1.1M logic cells, 5,520 DSP slices, 75.9 Mb BRAM.
- Power-efficient: 16nm FinFET+ technology.
- Interfaces: PCIe Gen3/4, 100G Ethernet, DDR4 memory support.
- Package: 1.0mm ball pitch, suitable for high-performance computing, networking, and signal processing.
Pin functions:
- Dedicated power/ground pins for core, I/O banks, and transceivers.
- Configuration pins (JTAG, SPI, SelectMAP).
- Clock inputs (differential/single-ended).
- High-speed serial transceivers (up to 16 lanes).
Key functions:
- High-speed I/O: Supports up to 32.75 Gb/s transceivers (GTH/GTY).
- Logic resources: ~1.1M logic cells, 5,520 DSP slices, 75.9 Mb BRAM.
- Power-efficient: 16nm FinFET+ technology.
- Interfaces: PCIe Gen3/4, 100G Ethernet, DDR4 memory support.
- Package: 1.0mm ball pitch, suitable for high-performance computing, networking, and signal processing.
Pin functions:
- Dedicated power/ground pins for core, I/O banks, and transceivers.
- Configuration pins (JTAG, SPI, SelectMAP).
- Clock inputs (differential/single-ended).
- High-speed serial transceivers (up to 16 lanes).
Application
The XCKU3P-1FFVB676I, a Kintex UltraScale+ FPGA, is used in:
- High-performance computing (HPC) – Accelerating AI/ML, data analytics.
- Aerospace & defense – Radar, EW, secure comms.
- Telecom & networking – 5G, optical transport, packet processing.
- Industrial automation – Real-time control, robotics.
- Medical imaging – Ultrasound, MRI processing.
- Video & broadcast – 4K/8K encoding, video switching.
Its high-speed interfaces (PCIe, 100G Ethernet) and DSP capabilities make it ideal for demanding applications.
- High-performance computing (HPC) – Accelerating AI/ML, data analytics.
- Aerospace & defense – Radar, EW, secure comms.
- Telecom & networking – 5G, optical transport, packet processing.
- Industrial automation – Real-time control, robotics.
- Medical imaging – Ultrasound, MRI processing.
- Video & broadcast – 4K/8K encoding, video switching.
Its high-speed interfaces (PCIe, 100G Ethernet) and DSP capabilities make it ideal for demanding applications.
