Part A
10M16DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 4171 PCS
- Package
- BGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF484C7G is a viable functional replacement candidate for the 10M16DAF256C8G, sharing the same Intel MAX 10 FPGA family, 16,000 logic elements, and core architecture. However, the differing package footprint and speed grade require careful validation before physical substitution.
Logic Element Count
High match
Package Type
Not compatible
Speed Grade
Validation required
Supply Voltage
High match
Parts at a glance
Part B
10M16DAF484C7G
Intel
- Lifecycle
- Active
- Stock
- 6583 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16DAF484C7G | Why it matters |
|---|---|---|---|
| Package / Pin Count | 256-pin FBGA | 484-pin FBGA | Different package and pin count affect PCB footprint, routing, and available I/O, so they are not drop-in footprint compatible. |
| Maximum User I/O | 178 | 346 | The 484-pin device exposes far more I/O, which is critical when the design requires many external interfaces. |
| Speed Grade | 8 (Commercial) | 7 (Commercial) | A lower speed grade number indicates faster timing performance, affecting maximum clock frequency and timing closure. |
| Logic Elements (LEs) | 16000 | 16000 | Identical logic capacity means both devices can implement the same logic complexity. |
| Embedded Memory | 562 kbit | 562 kbit | Equal embedded memory supports the same on-chip buffering and storage requirements. |
| 18x18 Multipliers | 160 | 160 | Same number of hardware multipliers ensures equivalent DSP throughput capability. |
| Core Supply Voltage | 1.15 V - 1.25 V | 1.15 V - 1.25 V | Matching core voltage allows the same power supply design and decoupling strategy. |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | Same commercial temperature range means both suit identical thermal environments. |
| Package Dimensions | 17 x 17 mm | 23 x 23 mm | Larger body size of the 484-pin device requires more board area and may affect mechanical fit. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256C8G | 10M16DAF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 10M16DAF256C8G and 10M16DAF484C7G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M16 density family, featuring 16,000 logic elements (LEs), non-volatile integrated flash configuration, and instant-on capability. The 10M16DAF256C8G uses a 256-ball FineLine BGA (FBGA) package, while the 10M16DAF484C7G uses a 484-ball FBGA package.
What is the difference in package and pin count between the two devices?
The 10M16DAF256C8G is offered in a 256-ball FBGA package, and the 10M16DAF484C7G is offered in a 484-ball FBGA package. The larger 484-ball package provides more user I/O pins and additional dedicated pins compared with the 256-ball version.
What do the speed grades C8 and C7 indicate?
The suffix C8 denotes a commercial temperature grade with speed grade 8, and C7 denotes a commercial temperature grade with speed grade 7. In Intel MAX 10 ordering codes, a lower speed grade number indicates a faster device, so the 10M16DAF484C7G (speed grade 7) is faster than the 10M16DAF256C8G (speed grade 8).
Are the two devices functionally interchangeable in an existing design?
No, they are not drop-in interchangeable. They differ in package footprint (256-ball FBGA vs 484-ball FBGA), pin count, available user I/O, and speed grade. A design targeting one device must be recompiled, re-pinned, and re-validated for the other device using the appropriate Intel Quartus Prime device support and pin-out files.
Do both devices support non-volatile instant-on configuration?
Yes. Both the 10M16DAF256C8G and 10M16DAF484C7G are MAX 10 FPGAs, which integrate on-die flash configuration memory. This allows them to configure themselves at power-up without an external configuration device, providing instant-on operation.
What core supply voltage do these MAX 10 devices require?
MAX 10 10M16 devices operate with a 1.2 V core supply (VCC) and support multiple I/O standards through their VCCIO banks. Designers should confirm exact supply and I/O voltage requirements in the Intel MAX 10 device datasheet and the respective device pin-out files.
Which device should be selected for a design requiring more user I/O?
The 10M16DAF484C7G should be selected when more user I/O is required, because its 484-ball FBGA package provides a higher pin count and more available user I/O than the 256-ball FBGA package of the 10M16DAF256C8G. The exact I/O count must be verified from the Intel MAX 10 device pin-out files for each package.
Can the 10M16DAF484C7G be used as a faster alternative to the 10M16DAF256C8G?
The 10M16DAF484C7G has a faster speed grade (7) than the 10M16DAF256C8G (8), so it can support higher internal timing performance. However, it is not a direct substitute because the package, pin count, and I/O availability differ. Any migration requires a full recompile and timing closure in Intel Quartus Prime.