10M16DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 4171 PCS
- Package
- BGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
This in-depth comparison of the 10M16DAF256C8G and 10M16DAF484I6G provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.
Replacement verdict
The 10M16DAF256C8G and 10M16DAF484I6G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and non-volatile instant-on architecture, making them functionally related devices. However, they differ in package type, pin count, and operating temperature grade, so the 10M16DAF484I6G is not a direct drop-in replacement for the 10M16DAF256C8G without PCB redesign and thermal validation.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16DAF484I6G | Why it matters |
|---|---|---|---|
| Package / Case | 256-FBGA (17x17) | 484-FBGA (23x23) | Different package footprints and ball counts are not drop-in compatible; PCB layout must be redesigned. |
| Number of I/Os | 178 | 346 | Available user I/O count determines how many peripherals and interfaces can be connected. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Industrial-grade parts support harsher environments; commercial parts may not meet the same reliability requirements. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster timing performance, affecting maximum clock frequency and timing closure. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic capacity means equivalent design complexity can be implemented in both devices. |
| Embedded Memory | 562 kbit | 562 kbit | Identical on-chip memory supports the same buffering and storage requirements. |
| Number of PLLs | 4 | 4 | Same PLL count allows equivalent clock generation and frequency synthesis schemes. |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | Identical core voltage requirements allow the same power supply design to be reused. |
| Manufacturer | Intel (Altera) | Intel (Altera) | Same manufacturer and product family ensures toolchain and IP compatibility. |
| Series / Family | MAX 10 | MAX 10 | Belonging to the same device family means shared architecture, documentation, and development tools. |
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Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256C8G | 10M16DAF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
The primary differences are package type, pin count, and speed grade. The 10M16DAF256C8G is a 256-pin FineLine BGA (FBGA) device with a commercial-grade speed grade of 8, while the 10M16DAF484I6G is a 484-pin FBGA device with an industrial-grade speed grade of 6. Both are Intel (Altera) MAX 10 family FPGAs with 16,000 logic elements, but the 484-pin variant offers more user I/O and is rated for industrial temperature operation.
No. The 10M16DAF256C8G uses a 256-pin FBGA package, while the 10M16DAF484I6G uses a 484-pin FBGA package. These packages have different physical dimensions, ball counts, and ball maps, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint.
Yes. Both the 10M16DAF256C8G and 10M16DAF484I6G are part of the Intel MAX 10 10M16 device family, which provides 16,000 logic elements (LEs) and 549,376 bits of M9K embedded memory. They also share the same number of 18x18 multipliers and PLLs, as these resources are determined by the device family and density, not the package option.
The 10M16DAF256C8G has a speed grade of 8, which is a slower speed grade in the Intel MAX 10 family. The 10M16DAF484I6G has a speed grade of 6, which is faster. A lower speed grade number indicates faster performance. Therefore, the 10M16DAF484I6G can operate at higher clock frequencies than the 10M16DAF256C8G under the same conditions.
The 10M16DAF256C8G is specified for commercial temperature operation, typically 0°C to 85°C junction temperature (TJ). The 10M16DAF484I6G is specified for industrial temperature operation, typically –40°C to 100°C junction temperature (TJ). The industrial rating of the 10M16DAF484I6G makes it suitable for harsher environments.
No. Because the two devices have different package sizes (256-pin vs. 484-pin FBGA), different pin counts, different speed grades, and different temperature ratings, they are not drop-in replacements. A redesign of the PCB footprint and a re-evaluation of timing and thermal requirements would be necessary.
The 10M16DAF484I6G offers more user I/O pins because it is housed in a 484-pin FBGA package, which provides a higher pin count than the 256-pin FBGA package of the 10M16DAF256C8G. The exact number of user I/O pins depends on the package and is specified in the Intel MAX 10 device pin-out files.
Yes. Both the 10M16DAF256C8G and the 10M16DAF484I6G are supported by Intel Quartus Prime software, including the Standard Edition and Lite Edition, as they belong to the same MAX 10 device family. Design compilation, pin assignment, and programming support are available for both package options.