Part A
5CEBA2U15I7N
Intel
- Lifecycle
- Active
- Stock
- 3669 PCS
- Package
- BGA-324
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEBA2U15I7N and 5CEBA7F31C7N are not drop-in replacements for one another. They differ fundamentally in logic density, package footprint, and I/O capability, making them suitable for entirely different design requirements within the Cyclone V family. The 5CEBA2U15I7N offers a compact UBGA-324 package with lower logic density, while the 5CEBA7F31C7N provides significantly higher logic density in a larger FBGA-896 package. Direct substitution is not feasible without substantial PCB redesign and resource re-evaluation.
Different logic density
Different package footprint
Different I/O count
Different transceiver count
Parts at a glance
Part B
5CEBA7F31C7N
Intel
- Lifecycle
- Active
- Stock
- 6794 PCS
- Package
- BGA-896
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA2U15I7N | 5CEBA7F31C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 25,000 | 150,000 | Logic element count determines the amount of programmable logic available for implementing custom digital functions; a large difference means the two devices are not functionally interchangeable for complex designs. |
| Embedded Memory | 1,080 Kbit | 6,912 Kbit | On-chip memory capacity affects the ability to store buffers, FIFOs, and lookup tables; designs requiring large memory blocks cannot be ported to the smaller device. |
| 18x18 Multipliers | 36 | 156 | Dedicated multipliers are essential for DSP and arithmetic-intensive applications; fewer multipliers limit parallel signal processing capability. |
| User I/O Pins | 240 | 480 | Available I/O pins determine how many external interfaces and peripherals can be connected; a mismatch can prevent direct board-level substitution. |
| Package | UBGA-324 | FBGA-896 | Package footprint and ball count must match the PCB layout; different packages are physically incompatible without a board redesign. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial-grade parts are required for extended-temperature applications where commercial parts may fail. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match the power delivery design; identical values indicate power supply compatibility. |
| Speed Grade | 7 (Fastest) | 7 (Fastest) | Speed grade determines maximum operating frequency and timing closure; matching grades ensures comparable performance characteristics. |
| Total RAM Bits | 1,080 Kbit | 6,912 Kbit | Total embedded RAM affects data buffering and storage capability; significant differences restrict design portability between the two devices. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA2U15I7N | 5CEBA7F31C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 56480 |
| Number of Logic Elements/Cells | 25000 | 149500 |
| Total RAM Bits | 2002944 | 7880704 |
| Number of I/O | 176 | 480 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEBA2U15I7N and the 5CEBA7F31C7N?
The 5CEBA2U15I7N is an Intel (Altera) Cyclone V FPGA with 25K logic elements in a 15x15 mm UBGA package, while the 5CEBA7F31C7N is a Cyclone V FPGA with 150K logic elements in a 31x31 mm FBGA package. They differ in logic density, package size, I/O count, and speed grade.
Are the 5CEBA2U15I7N and 5CEBA7F31C7N pin-to-pin compatible?
No. The 5CEBA2U15I7N uses a 15x15 mm UBGA package, and the 5CEBA7F31C7N uses a 31x31 mm FBGA package. They have different ball counts, ball maps, and PCB land patterns, so they are not pin-to-pin compatible.
Can the 5CEBA2U15I7N be used as a direct replacement for the 5CEBA7F31C7N?
No. The 5CEBA2U15I7N has significantly fewer logic elements (25K vs 150K), fewer I/O pins, and a different package footprint. A direct replacement is not possible without redesigning the PCB and verifying that the lower logic density meets the design requirements.
What are the operating temperature ranges for these two FPGAs?
The 5CEBA2U15I7N is specified for the industrial temperature range (I7 suffix), typically -40°C to 100°C junction temperature. The 5CEBA7F31C7N is specified for the commercial temperature range (C7 suffix), typically 0°C to 85°C junction temperature. The exact limits should be confirmed in the respective Intel Cyclone V datasheets.
Do both devices belong to the same FPGA family?
Yes. Both the 5CEBA2U15I7N and the 5CEBA7F31C7N are members of the Intel (Altera) Cyclone V FPGA family, specifically the E variant with transceiver capabilities. They share the same architecture and development tools but differ in density, package, and speed grade.
Which device offers higher logic density and more embedded resources?
The 5CEBA7F31C7N offers higher logic density with approximately 150,000 logic elements, compared to approximately 25,000 logic elements in the 5CEBA2U15I7N. The 5CEBA7F31C7N also provides more embedded memory, multipliers, and I/O pins, making it suitable for more complex designs.
Are the speed grades of these two devices the same?
No. The 5CEBA2U15I7N has a speed grade of 7 (I7), while the 5CEBA7F31C7N has a speed grade of 7 (C7). Although both are speed grade 7, the temperature suffix differs (I for industrial, C for commercial), which affects the operating conditions and timing performance.
What package types are used by the 5CEBA2U15I7N and 5CEBA7F31C7N?
The 5CEBA2U15I7N is housed in a 15x15 mm UBGA package (likely 324 balls), and the 5CEBA7F31C7N is housed in a 31x31 mm FBGA package (likely 896 balls). The exact ball counts and package outlines should be verified in the Intel Cyclone V device pin-out files.