Part A
5CEFA7F23I7N
Intel
- Lifecycle
- Active
- Stock
- 7313 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA7F23I7N and 5CEFA2M13I7N are not functionally interchangeable. The 5CEFA7F23I7N offers substantially higher logic density, greater embedded memory, and more multiplier resources, while the 5CEFA2M13I7N provides a smaller, lower-cost alternative with reduced I/O and transceiver capabilities. A direct substitution would require significant redesign of the PCB layout, power delivery, and logic implementation.
Different logic density
Different package footprint
Different I/O count
Different transceiver support
Parts at a glance
Part B
5CEFA2M13I7N
Intel
- Lifecycle
- Active
- Stock
- 6649 PCS
- Package
- TFBGA-383
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA7F23I7N | 5CEFA2M13I7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 150000 | 25000 | Logic element count determines the amount of programmable logic available for implementing custom digital functions; a large mismatch means the two devices are not functionally interchangeable for complex designs. |
| Total RAM Bits | 7880704 | 1945600 | Embedded memory capacity limits how much data can be buffered or stored on-chip, which is critical for memory-intensive applications such as video processing or data buffering. |
| Number of I/Os | 480 | 224 | The number of user I/O pins determines how many external signals the device can interface with, directly affecting board layout and peripheral connectivity. |
| Package / Case | FBGA-484 | MBGA-383 | Package type and footprint must match the PCB land pattern; different packages are not drop-in compatible and require a board redesign. |
| Number of Logic Array Blocks (LABs) | 5640 | 943 | LAB count reflects the granular architectural resources available for placement and routing, influencing achievable design density and timing closure. |
| Total Number of PLLs | 8 | 4 | PLLs generate and synchronize clock domains; fewer PLLs restrict the number of independent clock frequencies a design can support. |
| Maximum Operating Temperature | 100°C (TJ) | 100°C (TJ) | The maximum junction temperature defines the thermal envelope; both share the same industrial-grade rating, so thermal design constraints are equivalent. |
| Supply Voltage - Core | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match the board power delivery design; identical ranges mean the same power rail can supply either device. |
| Series | Cyclone V E | Cyclone V E | Devices from the same series share architecture, toolchain, and IP support, simplifying migration but not guaranteeing pin or resource compatibility. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA7F23I7N | 5CEFA2M13I7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA7F23I7N and the 5CEFA2M13I7N?
The 5CEFA7F23I7N and 5CEFA2M13I7N are both Intel (formerly Altera) Cyclone V F-series FPGAs, but they differ in logic density, package, and I/O count. The 5CEFA7F23I7N offers a larger logic array with 149,500 logic elements (LEs) in a 484-pin FBGA package, while the 5CEFA2M13I7N provides 25,000 LEs in a 383-pin Micro FBGA (MBGA) package. These differences affect available user I/Os, memory resources, and PCB layout requirements.
Are the 5CEFA7F23I7N and 5CEFA2M13I7N pin-to-pin compatible?
No. The 5CEFA7F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2M13I7N uses a 383-pin MBGA package (13 mm x 13 mm). The package sizes, ball counts, and ball maps differ, so they are not pin-to-pin compatible and cannot be interchanged without a PCB redesign.
Can the 5CEFA2M13I7N be used as a direct drop-in replacement for the 5CEFA7F23I7N?
No. A direct drop-in replacement is not possible because the two devices have different packages, pin counts, and logic capacities. The 5CEFA7F23I7N provides significantly more logic elements and I/O pins than the 5CEFA2M13I7N. Any substitution would require verifying that the smaller device meets the logic, memory, and I/O requirements of the design, and would also require a new PCB layout to accommodate the different package footprint.
What are the operating temperature ranges for these devices?
Both the 5CEFA7F23I7N and 5CEFA2M13I7N are specified with the "I7" speed grade and industrial temperature range. According to Intel Cyclone V device documentation, the industrial temperature range is typically –40°C to +100°C junction temperature (Tj). Designers should confirm the exact thermal limits in the latest Intel Cyclone V datasheet for the specific speed grade and package.
Do both devices support the same configuration and transceiver options?
Both are Cyclone V F-series FPGAs and share the same architecture family, including support for configuration via active serial, passive serial, JTAG, and other methods. However, the 5CEFA7F23I7N offers more transceiver channels and higher logic density than the 5CEFA2M13I7N. The exact number of transceivers and supported protocols depends on the specific package and device variant, so designers must consult the Intel Cyclone V datasheet and pin-out files for each part number.
Which device is better suited for space-constrained designs?
The 5CEFA2M13I7N is better suited for space-constrained designs because it uses a 13 mm x 13 mm 383-pin MBGA package, which is significantly smaller than the 23 mm x 23 mm 484-pin FBGA package of the 5CEFA7F23I7N. However, the smaller package also provides fewer user I/Os and less logic capacity, so it is appropriate only for lower-density applications.
Are the 5CEFA7F23I7N and 5CEFA2M13I7N RoHS compliant?
Intel Cyclone V devices, including the 5CEFA7F23I7N and 5CEFA2M13I7N, are generally available in RoHS-compliant packages. However, compliance status can vary by ordering code and date code. Designers should verify the RoHS and lead-free status using the specific ordering information and material declaration documents available from Intel or authorized distributors such as DigiKey, Mouser, or TTI.
What logic density does each device provide?
The 5CEFA7F23I7N provides 149,500 logic elements (LEs), while the 5CEFA2M13I7N provides 25,000 LEs. This means the 5CEFA7F23I7N offers approximately six times the logic capacity of the 5CEFA2M13I7N, making it suitable for more complex designs that require greater programmable logic resources, embedded memory, and DSP blocks.