5CEFA5U19I7N
Intel
- Lifecycle
- Active
- Stock
- 1812 PCS
- Package
- UBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
This in-depth comparison of the 5CEFA5U19I7N and 5CEFA9F27I7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.
Replacement verdict
The 5CEFA9F27I7N and 5CEFA5U19I7N are both Intel Cyclone V F-series FPGAs sharing the same 28 nm process, 1.1 V core architecture, and industrial temperature rating, making them functionally related but not drop-in equivalent. The 5CEFA9F27I7N offers substantially higher logic density and a larger FBGA-672 package, while the 5CEFA5U19I7N provides a more compact UBGA-484 footprint with lower resource counts. Designers must validate logic capacity, I/O count, and PCB footprint before substituting, as the two devices differ in density class and package form factor.
Intel
Intel
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA5U19I7N | 5CEFA9F27I7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 29080 | 113560 |
| Number of Logic Elements/Cells | 77000 | 301000 |
| Total RAM Bits | 5001216 | 14251008 |
| Number of I/O | 224 | 336 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |