DSP56F805FV80E vs DSP56F802TA60E

This in-depth comparison of the DSP56F805FV80E and DSP56F802TA60E provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56F805FV80E

NXP USA Inc.

Lifecycle
Active
Stock
3106 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

DSP56F802TA60E

NXP USA Inc.

Lifecycle
Active
Stock
6795 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56F805FV80E DSP56F802TA60E
Series 56F8xx 56F8xx
Part Status Active Obsolete
Core Processor 56800 56800
Core Size 16-Bit 16-Bit
Speed 80MHz 60MHz
Connectivity CANbus, EBI/EMI, SCI, SPI SCI
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 32 8
Program Memory Size 64KB (32K x 16) 16KB (8K x 16)
Program Memory Type FLASH FLASH
RAM Size 2K x 16 1K x 16
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 5x12b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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