DSP56F807VF80E vs DSP56321VF275

This in-depth comparison of the DSP56F807VF80E and DSP56321VF275 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56F807VF80E

NXP USA Inc.

Lifecycle: Active
Stock: 3987 PCS
Package: MAPBGA-160
Series: Embedded - Microcontrollers

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Part B

DSP56321VF275

NXP USA Inc.

Lifecycle: Active
Stock: 8786 PCS
Package: BGA-196
Series: Embedded - DSP (Digital Signal Processors)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	DSP56F807VF80E	DSP56321VF275
Supplier	-	Rochester Electronics, LLC,NXP USA Inc.
Series	56F8xx	DSP56K/Symphony
Part Status	Active	Last Time Buy
Type	-	Fixed Point
Interface	-	Host Interface, SSI, SCI
Clock Rate	-	275MHz
Non - Volatile Memory	-	ROM (576B)
On - Chip RAM	-	576kB
Voltage - I / O	-	3.30V
Voltage - Core	-	1.60V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 100°C (TJ)
Mounting Type	Surface Mount	Surface Mount
Core Processor	56800	-
Core Size	16-Bit	-
Speed	80MHz	-
Connectivity	CANbus, EBI/EMI, SCI, SPI	-
Peripherals	POR, PWM, WDT	-
Number of I/O	32	-
Program Memory Size	120KB (60K x 16)	-
Program Memory Type	FLASH	-
RAM Size	4K x 16	-
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	-
Data Converters	A/D 16x12b	-
Oscillator Type	External	-

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