DSP56F807VF80E vs DSP56F807VF80

This in-depth comparison of the DSP56F807VF80E and DSP56F807VF80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56F807VF80E

NXP USA Inc.

Lifecycle
Active
Stock
3987 PCS
Package
MAPBGA-160
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

DSP56F807VF80

NXP USA Inc.

Lifecycle
Active
Stock
4165 PCS
Package
MAPBGA-160
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56F807VF80E DSP56F807VF80
Series 56F8xx 56F8xx
Part Status Active Obsolete
Core Processor 56800 56800
Core Size 16-Bit 16-Bit
Speed 80MHz 80MHz
Connectivity CANbus, EBI/EMI, SCI, SPI CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 32 32
Program Memory Size 120KB (60K x 16) 120KB (60K x 16)
Program Memory Type FLASH FLASH
RAM Size 4K x 16 4K x 16
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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