DSPB56364AF100 vs DSPB56374AF

This in-depth comparison of the DSPB56364AF100 and DSPB56374AF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSPB56364AF100

NXP USA Inc.

Lifecycle
Active
Stock
5554 PCS
Package
LQFP-100
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSPB56374AF

NXP USA Inc.

Lifecycle
Active
Stock
7452 PCS
Package
LQFP-80
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSPB56364AF100 DSPB56374AF
Supplier - NXP USA Inc.
Series DSP56K/Symphony DSP56K/Symphony
Part Status Obsolete Obsolete
Type Audio Processor Audio Processor
Interface Host Interface, I²C, SAI, SPI Host Interface, I²C, SAI, SPI
Clock Rate 100MHz 150MHz
Non - Volatile Memory ROM (24kB) ROM (84kB)
On - Chip RAM 11.25kB 54kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 3.30V 1.25V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
Compare RFQ