DSPB56720AG vs DSPB56364AF100

This in-depth comparison of the DSPB56720AG and DSPB56364AF100 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSPB56720AG

NXP USA Inc.

Lifecycle
Active
Stock
7476 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSPB56364AF100

NXP USA Inc.

Lifecycle
Active
Stock
5554 PCS
Package
LQFP-100
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSPB56720AG DSPB56364AF100
Series DSP56K/Symphony DSP56K/Symphony
Part Status Not For New Designs Obsolete
Type Audio Processor Audio Processor
Interface Host Interface, I²C, SAI, SPI Host Interface, I²C, SAI, SPI
Clock Rate 200MHz 100MHz
Non - Volatile Memory External ROM (24kB)
On - Chip RAM 744kB 11.25kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 1.00V 3.30V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
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