DSPB56367AG150 vs DSPB56720CAG

This in-depth comparison of the DSPB56367AG150 and DSPB56720CAG provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSPB56367AG150

NXP USA Inc.

Lifecycle
Active
Stock
6377 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSPB56720CAG

NXP USA Inc.

Lifecycle
Active
Stock
4231 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSPB56367AG150 DSPB56720CAG
Supplier - NXP USA Inc.
Series DSP56K/Symphony DSP56K/Symphony
Part Status Not For New Designs Not For New Designs
Type Audio Processor Audio Processor
Interface Host Interface, I²C, SAI, SPI Host Interface, I²C, SAI, SPI
Clock Rate 150MHz 200MHz
Non - Volatile Memory ROM (240kB) External
On - Chip RAM 69kB 744kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 1.80V 1.00V
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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