DSPB56364AF100 vs DSPB56367AG150

This in-depth comparison of the DSPB56364AF100 and DSPB56367AG150 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSPB56364AF100

NXP USA Inc.

Lifecycle
Active
Stock
5554 PCS
Package
LQFP-100
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSPB56367AG150

NXP USA Inc.

Lifecycle
Active
Stock
6377 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSPB56364AF100 DSPB56367AG150
Series DSP56K/Symphony DSP56K/Symphony
Part Status Obsolete Not For New Designs
Type Audio Processor Audio Processor
Interface Host Interface, I²C, SAI, SPI Host Interface, I²C, SAI, SPI
Clock Rate 100MHz 150MHz
Non - Volatile Memory ROM (24kB) ROM (240kB)
On - Chip RAM 11.25kB 69kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 3.30V 1.80V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
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