EP2C5F256I8N vs EP2C50F484C7

This in-depth comparison of the EP2C5F256I8N and EP2C50F484C7 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP2C5F256I8N

Intel

Lifecycle: Active
Stock: 3558 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP2C50F484C7

Intel

Lifecycle: Active
Stock: 5541 PCS
Package: BGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP2C5F256I8N	EP2C50F484C7
Supplier	-	Intel
Series	Cyclone® II	Cyclone® II
Part Status	Active	Active
Number of LABs/CLBs	288	3158
Number of Logic Elements/Cells	4608	50528
Total RAM Bits	119808	594432
Number of I/O	158	294
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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