EP2C5F256I8N vs EP2C5F256C7

This in-depth comparison of the EP2C5F256I8N and EP2C5F256C7 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP2C5F256I8N

Intel

Lifecycle: Active
Stock: 3558 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP2C5F256C7

Intel

Lifecycle: Active
Stock: 9459 PCS
Package: LBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP2C5F256I8N	EP2C5F256C7
Supplier	-	Intel
Series	Cyclone® II	Cyclone® II
Part Status	Active	Active
Number of LABs/CLBs	288	288
Number of Logic Elements/Cells	4608	4608
Total RAM Bits	119808	119808
Number of I/O	158	158
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

Compare RFQ