FDG6322C vs FDG6306P

This in-depth comparison of the FDG6306P and FDG6322C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
FDG6306P

+BOM

20835 PCS | onsemi
FDG6322C

+BOM

4629 PCS | onsemi
Package 6-TSSOP, SC-88, SOT-363 6-TSSOP, SC-88, SOT-363
Description MOSFET 2P-CH 20V 600MA SC88 MOSFET N/P-CH 25V SC70-6
Supplier onsemi,Rochester Electronics, LLC onsemi
Series PowerTrench® -
ProductStatus Active Active
FETType 2 P-Channel (Dual) N and P-Channel
FETFeature Logic Level Gate Logic Level Gate
DraintoSourceVoltage(Vdss) 20V 25V
Current-ContinuousDrain(Id)@25°C 600mA 220mA, 410mA
RdsOn(Max)@IdVgs 420mOhm @ 600mA, 4.5V 4Ohm @ 220mA, 4.5V
Vgs(th)(Max)@Id 1.5V @ 250µA 1.5V @ 250µA
GateCharge(Qg)(Max)@Vgs 2nC @ 4.5V 0.4nC @ 4.5V
InputCapacitance(Ciss)(Max)@Vds 114pF @ 10V 9.5pF @ 10V
Power-Max 300mW 300mW
OperatingTemperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
MountingType Surface Mount Surface Mount
Comparison Model : FDG6306P FDG6322C

+BOM RFQ