FDG6332C vs FDG6318PZ

This in-depth comparison of the FDG6332C and FDG6318PZ provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDG6332C

onsemi

Lifecycle
Active
Stock
2173 PCS
Package
TSSOP-6
Series
Transistors - FETs, MOSFETs - Arrays
+BOM RFQ
Part B

FDG6318PZ

onsemi

Lifecycle
Active
Stock
3452 PCS
Package
SC-88
Series
Transistors - FETs, MOSFETs - Arrays
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification FDG6332C FDG6318PZ
Supplier - onsemi
Part Status Active Obsolete
FET Type N and P-Channel 2 P-Channel (Dual)
FET Feature Logic Level Gate Logic Level Gate
Drain to Source Voltage (Vdss) 20V 20V
Current - Continuous Drain(Id) @ 25°C 700mA, 600mA 500mA
Rds On(Max) @ Id Vgs 300mOhm @ 700mA, 4.5V 780mOhm @ 500mA, 4.5V
Vgs(th)(Max) @ Id 1.5V @ 250µA 1.5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs 1.5nC @ 4.5V 1.62nC @ 4.5V
Input Capacitance(Ciss)(Max) @ Vds 113pF @ 10V 85.4pF @ 10V
Power - Max 300mW 300mW
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Series PowerTrench® -
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