FDG6320C vs FDG6332C

This in-depth comparison of the FDG6320C and FDG6332C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

FDG6320C

onsemi

Lifecycle
Active
Stock
1672 PCS
Package
TSSOP-6
Series
Transistors - FETs, MOSFETs - Arrays
+BOM RFQ
Part B

FDG6332C

onsemi

Lifecycle
Active
Stock
2173 PCS
Package
TSSOP-6
Series
Transistors - FETs, MOSFETs - Arrays
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification FDG6320C FDG6332C
Part Status Obsolete Active
FET Type N and P-Channel N and P-Channel
FET Feature Logic Level Gate Logic Level Gate
Drain to Source Voltage (Vdss) 25V 20V
Current - Continuous Drain(Id) @ 25°C 220mA, 140mA 700mA, 600mA
Rds On(Max) @ Id Vgs 4Ohm @ 220mA, 4.5V 300mOhm @ 700mA, 4.5V
Vgs(th)(Max) @ Id 1.5V @ 250µA 1.5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs 0.4nC @ 4.5V 1.5nC @ 4.5V
Input Capacitance(Ciss)(Max) @ Vds 9.5pF @ 10V 113pF @ 10V
Power - Max 300mW 300mW
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Series - PowerTrench®
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