FDMS86101 vs FDMS86101DC

This in-depth comparison of the FDMS86101 and FDMS86101DC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDMS86101

onsemi

Lifecycle: Active
Stock: 2279 PCS
Package: TDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

Part B

FDMS86101DC

onsemi

Lifecycle: Active
Stock: 4245 PCS
Package: TDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDMS86101	FDMS86101DC
Series	PowerTrench®	Dual Cool™, PowerTrench®
Part Status	Active	Active
FET Type	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	100 V	100 V
Current - Continuous Drain(Id) @ 25°C	12.4A (Ta), 60A (Tc)	14.5A (Ta), 60A (Tc)
Drive Voltage(Max Rds On Min Rds On)	6V, 10V	6V, 10V
Rds On(Max) @ Id Vgs	8mOhm @ 13A, 10V	7.5mOhm @ 14.5A, 10V
Vgs(th)(Max) @ Id	4V @ 250µA	4V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	55 nC @ 10 V	44 nC @ 10 V
Vgs(Max)	±20V	±20V
Input Capacitance(Ciss)(Max) @ Vds	3000 pF @ 50 V	3135 pF @ 50 V
Power Dissipation (Max)	2.5W (Ta), 104W (Tc)	3.2W (Ta), 125W (Tc)
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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