FDMS86150 vs FDMS8460

This in-depth comparison of the FDMS86150 and FDMS8460 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDMS86150

onsemi

Lifecycle: Active
Stock: 4382 PCS
Package: TDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

Part B

FDMS8460

onsemi

Lifecycle: Active
Stock: 1854 PCS
Package: TDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDMS86150	FDMS8460
Series	PowerTrench®	PowerTrench®
Part Status	Active	Active
FET Type	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	100 V	40 V
Current - Continuous Drain(Id) @ 25°C	16A (Ta), 60A (Tc)	25A (Ta), 49A (Tc)
Drive Voltage(Max Rds On Min Rds On)	6V, 10V	4.5V, 10V
Rds On(Max) @ Id Vgs	4.85mOhm @ 16A, 10V	2.2mOhm @ 25A, 10V
Vgs(th)(Max) @ Id	4V @ 250µA	3V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	62 nC @ 10 V	110 nC @ 10 V
Vgs(Max)	±20V	±20V
Input Capacitance(Ciss)(Max) @ Vds	4065 pF @ 50 V	7205 pF @ 20 V
Power Dissipation (Max)	2.7W (Ta), 156W (Tc)	2.5W (Ta), 104W (Tc)
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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