HD6417712BPV vs HD6417727BP100CV

This in-depth comparison of the HD6417712BPV and HD6417727BP100CV provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

HD6417712BPV

Renesas Electronics America Inc

Lifecycle
Active
Stock
1239 PCS
Package
LFBGA-256
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

HD6417727BP100CV

Renesas Electronics America Inc

Lifecycle
Active
Stock
5166 PCS
Package
LFBGA-240
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification HD6417712BPV HD6417727BP100CV
Supplier - Renesas Electronics America Inc
Series SuperH® SH Ethernet SuperH® SH7700
Part Status Last Time Buy Active
Core Processor SH-3 DSP SH-3 DSP
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 200MHz 100MHz
Connectivity EBI/EMI, Ethernet, FIFO, SCI, SIO FIFO, SCI, SIO, SmartCard, USB
Peripherals DMA, POR, WDT DMA, LCD, POR, WDT
Number of I/O 24 104
Program Memory Type ROMless ROMless
RAM Size 16K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 1.6V 1.6V ~ 2.05V
Data Converters - A/D 6x10b; D/A 2x8b
Oscillator Type External Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount
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