HD6417712BPV vs HD6417760BL200AV Comparison

This in-depth comparison of the HD6417712BPV and HD6417760BL200AV provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
HD6417712BPV

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1239 PCS | Renesas Electronics America Inc
HD6417760BL200AV

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8568 PCS | Renesas Electronics America Inc
Package LFBGA-256 LFBGA-256
Description IC MCU 32BIT ROMLESS 256LFBGA IC MCU 32BIT ROMLESS 256LFBGA
Series SuperH® SH Ethernet SuperH® SH7750
Part Status Last Time Buy Last Time Buy
Core Processor SH-3 DSP SH-4
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 200MHz 200MHz
Connectivity EBI/EMI, Ethernet, FIFO, SCI, SIO Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals DMA, POR, WDT DMA, LCD, POR, WDT
Number of I/O 24 69
Program Memory Type ROMless ROMless
RAM Size 16K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 1.6V 1.4V ~ 1.6V
Data Converters - A/D 4x10b
Oscillator Type External Internal
Operating Temperature -20°C ~ 75°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : HD6417712BPV HD6417760BL200AV

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