IRF7341PBF vs IRF7304PBF

This in-depth comparison of the IRF7341PBF and IRF7304PBF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

IRF7341PBF

Infineon Technologies

Lifecycle: Active
Stock: 4680 PCS
Package: SOIC-8
Series: Transistors - FETs, MOSFETs - Arrays

+BOM RFQ

Part B

IRF7304PBF

Infineon Technologies

Lifecycle: Active
Stock: 2321 PCS
Package: SOIC-8
Series: Transistors - FETs, MOSFETs - Arrays

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	IRF7341PBF	IRF7304PBF
Supplier	Rochester Electronics, LLC,Infineon Technologies	Infineon Technologies
Series	HEXFET®	HEXFET®
Part Status	Discontinued at Digi-Key	Discontinued at Digi-Key
FET Type	2 N-Channel (Dual)	2 P-Channel (Dual)
FET Feature	Logic Level Gate	Logic Level Gate
Drain to Source Voltage (Vdss)	55V	20V
Current - Continuous Drain(Id) @ 25°C	4.7A	4.3A
Rds On(Max) @ Id Vgs	50mOhm @ 4.7A, 10V	90mOhm @ 2.2A, 4.5V
Vgs(th)(Max) @ Id	1V @ 250µA	700mV @ 250µA
Gate Charge(Qg)(Max) @ Vgs	36nC @ 10V	22nC @ 4.5V
Input Capacitance(Ciss)(Max) @ Vds	740pF @ 25V	610pF @ 15V
Power - Max	2W	2W
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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