IRFP4310ZPBF vs IRFP460APBF

This in-depth comparison of the IRFP4310ZPBF and IRFP460APBF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

IRFP4310ZPBF

Infineon Technologies

Lifecycle: Active
Stock: 3590 PCS
Package: TO-247-3
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

Part B

IRFP460APBF

Vishay Siliconix

Lifecycle: Active
Stock: 3680 PCS
Package: TO-247-3
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	IRFP4310ZPBF	IRFP460APBF
Series	HEXFET®	-
Part Status	Active	Active
FET Type	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	100 V	500 V
Current - Continuous Drain(Id) @ 25°C	120A (Tc)	20A (Tc)
Drive Voltage(Max Rds On Min Rds On)	10V	10V
Rds On(Max) @ Id Vgs	6mOhm @ 75A, 10V	270mOhm @ 12A, 10V
Vgs(th)(Max) @ Id	4V @ 150µA	4V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	170 nC @ 10 V	105 nC @ 10 V
Vgs(Max)	±20V	±30V
Input Capacitance(Ciss)(Max) @ Vds	6860 pF @ 50 V	3100 pF @ 25 V
Power Dissipation (Max)	280W (Tc)	280W (Tc)
Operating Temperature	-55°C ~ 175°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Through Hole	Through Hole

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