LPC2378FBD144K vs LPC2366FBD100K

This in-depth comparison of the LPC2378FBD144K and LPC2366FBD100K provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

LPC2378FBD144K

NXP USA Inc.

Lifecycle
Active
Stock
7609 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

LPC2366FBD100K

NXP USA Inc.

Lifecycle
Active
Stock
1516 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification LPC2378FBD144K LPC2366FBD100K
Series LPC2300 LPC2300
Part Status Active Active
Core Processor ARM7® ARM7®
Core Size 16/32-Bit 16/32-Bit
Speed 72MHz 72MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 104 70
Program Memory Size 512KB (512K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 58K x 8 58K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x10b SAR; D/A 1x10b A/D 6x10b SAR; D/A 1x10b
Oscillator Type External, Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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