LPC2387FBD100K vs LPC2378FBD144K

This in-depth comparison of the LPC2387FBD100K and LPC2378FBD144K provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
LPC2387FBD100K

+BOM

5760 PCS | NXP USA Inc.
LPC2378FBD144K

+BOM

7609 PCS | NXP USA Inc.
Package LQFP-144
Description IC MCU 16/32B 512KB FLSH 100LQFP IC MCU 16/32B 512KB FLSH 144LQFP
Series LPC2300 LPC2300
ProductStatus - Active
CoreProcessor - ARM7®
CoreSize - 16/32-Bit
Speed 72MHz 72MHz
Connectivity CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
NumberofI/O - 104
ProgramMemorySize - 512KB (512K x 8)
ProgramMemoryType - FLASH
RAMSize - 58K x 8
Voltage-Supply(Vcc/Vdd) - 3V ~ 3.6V
DataConverters - A/D 8x10b SAR; D/A 1x10b
OscillatorType - External, Internal
OperatingTemperature - -40°C ~ 85°C (TA)
MountingType - Surface Mount
Part Status Active -
Base Product Number LPC2387 -
DigiKey Programmable Not Verified -
Packaging Tray -
Comparison Model : LPC2387FBD100K LPC2378FBD144K

+BOM RFQ