MC33883HEGR2 vs MC33882PEK

This in-depth comparison of the MC33883HEGR2 and MC33882PEK provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC33883HEGR2

NXP USA Inc.

Lifecycle
Active
Stock
4912 PCS
Package
SOIC-20
Series
PMIC - Gate Drivers
+BOM RFQ
Part B

MC33882PEK

NXP USA Inc.

Lifecycle
Active
Stock
4 PCS
Package
SOIC-32
Series
PMIC - Power Distribution Switches, Load Drivers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC33883HEGR2 MC33882PEK
Part Status - Active
Switch Type - General Purpose
Number of Outputs - 6
Ratio - Input: Output - 1:1
Output Configuration - Low Side
Output Type - N-Channel
Interface - SPI, Parallel
Voltage - Load - 8V ~ 25V
Voltage - Supply (Vcc/Vdd) - 4.5V ~ 5.5V
Rds On (Typ) - 400mOhm
Fault Protection - Current Limiting (Fixed), Open Load Detect, Over Voltage
Operating Temperature - -40°C ~ 150°C (TJ)
Mounting Type - Surface Mount
Series Bulk -
Driven Configuration Active -
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