MC33883HEGR2 vs MC33883DW

This in-depth comparison of the MC33883HEGR2 and MC33883DW provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC33883HEGR2

NXP USA Inc.

Lifecycle: Active
Stock: 4912 PCS
Package: SOIC-20
Series: PMIC - Gate Drivers

+BOM RFQ

Part B

MC33883DW

NXP USA Inc.

Lifecycle: Active
Stock: 5876 PCS
Package: SOIC-20
Series: PMIC - Gate Drivers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC33883HEGR2	MC33883DW
Part Status	-	Obsolete
Driven Configuration	Active	Half-Bridge
Channel Type	-	Independent
Number of Drivers	-	4
Gate Type	-	N-Channel MOSFET
Voltage - Supply	-	5.5V ~ 28V
Logic Voltage - VILVIH	-	0.8V, 2V
Current - Peak Output(Source Sink)	-	1A, 1A
Input Type	-	Non-Inverting
High Side Voltage - Max(Bootstrap)	-	55 V
Rise / Fall Time(Typ)	-	80ns, 80ns
Operating Temperature	-	-40°C ~ 150°C (TJ)
Mounting Type	-	Surface Mount
Series	Bulk	-

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