MC56F8323VFBE vs MC56F8366MFVE Comparison
This in-depth comparison of the MC56F8323VFBE and MC56F8366MFVE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Package
LQFP-64
LQFP-144
Description
IC MCU 16BIT 32KB FLASH 64LQFP
IC MCU 16BIT 512KB FLASH 144LQFP
Supplier
-
Flip Electronics,NXP USA Inc.
Series
56F8xxx
56F8xxx
Part Status
Not For New Designs
Active
Core Processor
56800E
56800E
Core Size
16-Bit
16-Bit
Speed
60MHz
60MHz
Connectivity
CANbus, SCI, SPI
CANbus, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
POR, PWM, Temp Sensor, WDT
Number of I/O
27
62
Program Memory Size
32KB (16K x 16)
512KB (256K x 16)
Program Memory Type
FLASH
FLASH
RAM Size
12K x 8
18K x 16
Voltage - Supply (Vcc/Vdd)
2.25V ~ 3.6V
2.25V ~ 3.6V
Data Converters
A/D 8x12b
A/D 16x12b
Oscillator Type
Internal
External
Operating Temperature
-40°C ~ 105°C (TA)
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Surface Mount
