MC68302EH20C vs MC68331CAG25

This in-depth comparison of the MC68302EH20C and MC68331CAG25 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68302EH20C

NXP USA Inc.

Lifecycle
Active
Stock
3310 PCS
Package
SOT1703-1
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68331CAG25

NXP USA Inc.

Lifecycle
Active
Stock
2132 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68302EH20C MC68331CAG25
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Not For New Designs
Core Processor M68000 CPU32
Core Size - 32-Bit Single-Core
Speed 20MHz 25MHz
Connectivity - EBI/EMI, SCI, SPI, UART/USART
Peripherals - POR, PWM, WDT
Number of I/O - 18
Program Memory Type - ROMless
Voltage - Supply (Vcc/Vdd) - 4.5V ~ 5.5V
Oscillator Type - Internal
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
Number of Cores / Bus Width 1 Core, 8/16-Bit -
Co - Processors / DSP Communications; RISC CPM -
RAM Controllers DRAM -
Graphics Acceleration No -
Voltage - I / O 5.0V -
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