MC68302EH20C vs MC68340CAB16E

This in-depth comparison of the MC68302EH20C and MC68340CAB16E provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68302EH20C

NXP USA Inc.

Lifecycle
Active
Stock
3310 PCS
Package
SOT1703-1
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68340CAB16E

NXP USA Inc.

Lifecycle
Active
Stock
125 PCS
Package
BQFP-144
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68302EH20C MC68340CAB16E
Supplier - Flip Electronics,NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Obsolete
Core Processor M68000 CPU32
Number of Cores / Bus Width 1 Core, 8/16-Bit 1 Core, 32-Bit
Speed 20MHz 16MHz
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Voltage - I / O 5.0V 5.0V
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Co - Processors / DSP Communications; RISC CPM -
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