MC68302FC16C vs MC68336GMAB20

This in-depth comparison of the MC68302FC16C and MC68336GMAB20 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MC68302FC16C

NXP USA Inc.

Lifecycle
Active
Stock
1354 PCS
Package
PQFP-132
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MC68336GMAB20

NXP USA Inc.

Lifecycle
Active
Stock
4529 PCS
Package
BQFP-160
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68302FC16C MC68336GMAB20
Supplier - NXP USA Inc.
Series M683xx M683xx
Part Status Obsolete Obsolete
Core Processor M68000 CPU32
Core Size - 32-Bit Single-Core
Speed 16MHz 20MHz
Connectivity - CANbus, EBI/EMI, SCI, SPI
Peripherals - POR, PWM, WDT
Number of I/O - 18
Program Memory Type - ROMless
RAM Size - 7.5K x 8
Voltage - Supply (Vcc/Vdd) - 4.75V ~ 5.25V
Data Converters - A/D 16x10b
Oscillator Type - External
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 125°C (TA)
Mounting Type - Surface Mount
Number of Cores / Bus Width 1 Core, 8/16-Bit -
Co - Processors / DSP Communications; RISC CPM -
RAM Controllers DRAM -
Graphics Acceleration No -
Voltage - I / O 5.0V -
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