MC68332ACEH25 vs MC68336GCAB20

This in-depth comparison of the MC68332ACEH25 and MC68336GCAB20 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC68332ACEH25

NXP USA Inc.

Lifecycle
Active
Stock
2529 PCS
Package
PQFP-132
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC68336GCAB20

NXP USA Inc.

Lifecycle
Active
Stock
9729 PCS
Package
BQFP-160
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC68332ACEH25 MC68336GCAB20
Supplier - NXP USA Inc.
Series M683xx M683xx
Part Status Not For New Designs Obsolete
Core Processor CPU32 CPU32
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 25MHz 20MHz
Connectivity EBI/EMI, SCI, SPI, UART/USART CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 15 18
Program Memory Type ROMless ROMless
RAM Size 2K x 8 7.5K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.75V ~ 5.25V
Data Converters - A/D 16x10b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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