MC908GP32CFBE vs MC908GZ60CFAE

This in-depth comparison of the MC908GP32CFBE and MC908GZ60CFAE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908GP32CFBE

NXP USA Inc.

Lifecycle: Active
Stock: 2144 PCS
Package: SOT803-2
Series: Embedded - Microcontrollers

+BOM RFQ

Part B

MC908GZ60CFAE

NXP USA Inc.

Lifecycle: Active
Stock: 9246 PCS
Package: LQFP-48
Series: Embedded - Microcontrollers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC908GP32CFBE	MC908GZ60CFAE
Supplier	-	Flip Electronics
Series	-	HC08
Part Status	Active	Not For New Designs
Core Processor	-	M68HC08
Core Size	-	8-Bit
Speed	-	8MHz
Connectivity	-	CANbus, LINbus, SCI, SPI
Peripherals	-	LVD, POR, PWM
Number of I/O	-	37
Program Memory Size	-	60KB (60K x 8)
Program Memory Type	-	FLASH
RAM Size	-	2K x 8
Voltage - Supply (Vcc/Vdd)	-	3V ~ 5.5V
Data Converters	-	A/D 24x10b SAR
Oscillator Type	-	Internal
Operating Temperature	-	-40°C ~ 85°C (TA)
Mounting Type	-	Surface Mount

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