MC908GP32CFBE vs MC908JL3ECPE

This in-depth comparison of the MC908GP32CFBE and MC908JL3ECPE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908GP32CFBE

NXP USA Inc.

Lifecycle
Active
Stock
2144 PCS
Package
SOT803-2
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908JL3ECPE

NXP USA Inc.

Lifecycle
Active
Stock
5505 PCS
Package
DIP-28
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908GP32CFBE MC908JL3ECPE
Supplier - Flip Electronics
Series - HC08
Part Status Active Obsolete
Core Processor - HC08
Core Size - 8-Bit
Speed - 8MHz
Peripherals - LED, LVD, POR, PWM
Number of I/O - 23
Program Memory Size - 4KB (4K x 8)
Program Memory Type - FLASH
RAM Size - 128 x 8
Voltage - Supply (Vcc/Vdd) - 2.7V ~ 3.3V
Data Converters - A/D 12x8b
Oscillator Type - External
Operating Temperature - -40°C ~ 85°C (TA)
Mounting Type - Through Hole
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