MC908JK3ECDWE vs MC908GZ60CFAE

This in-depth comparison of the MC908JK3ECDWE and MC908GZ60CFAE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908JK3ECDWE

NXP USA Inc.

Lifecycle: Active
Stock: 4235 PCS
Package: SOT163-5
Series: Embedded - Microcontrollers

+BOM RFQ

Part B

MC908GZ60CFAE

NXP USA Inc.

Lifecycle: Active
Stock: 9246 PCS
Package: LQFP-48
Series: Embedded - Microcontrollers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC908JK3ECDWE	MC908GZ60CFAE
Supplier	-	Flip Electronics
Series	HC08	HC08
Part Status	Not For New Designs	Not For New Designs
Core Processor	HC08	M68HC08
Core Size	8-Bit	8-Bit
Speed	8MHz	8MHz
Connectivity	-	CANbus, LINbus, SCI, SPI
Peripherals	LED, LVD, POR, PWM	LVD, POR, PWM
Number of I/O	15	37
Program Memory Size	4KB (4K x 8)	60KB (60K x 8)
Program Memory Type	FLASH	FLASH
RAM Size	128 x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.3V	3V ~ 5.5V
Data Converters	A/D 12x8b	A/D 24x10b SAR
Oscillator Type	External	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount

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