MC908JK3ECDWE vs MC908MR16CBE

This in-depth comparison of the MC908JK3ECDWE and MC908MR16CBE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908JK3ECDWE

NXP USA Inc.

Lifecycle
Active
Stock
4235 PCS
Package
SOT163-5
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908MR16CBE

NXP USA Inc.

Lifecycle
Active
Stock
3339 PCS
Package
SDIP-56
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908JK3ECDWE MC908MR16CBE
Supplier - NXP USA Inc.
Series HC08 HC08
Part Status Not For New Designs Obsolete
Core Processor HC08 HC08
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SCI, SPI
Peripherals LED, LVD, POR, PWM LVD, POR, PWM
Number of I/O 15 36
Program Memory Size 4KB (4K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
RAM Size 128 x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V 4.5V ~ 5.5V
Data Converters A/D 12x8b A/D 10x10b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Through Hole
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