MC9S08FL8CLC vs MC9S08PL16CLD

This in-depth comparison of the MC9S08FL8CLC and MC9S08PL16CLD provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08FL8CLC

NXP USA Inc.

Lifecycle
Active
Stock
2401 PCS
Package
LQFP-32
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08PL16CLD

NXP USA Inc.

Lifecycle
Active
Stock
6256 PCS
Package
LQFP-44
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08FL8CLC MC9S08PL16CLD
Supplier - NXP USA Inc.
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Connectivity SCI LINbus, SCI, UART/USART
Peripherals LVD, PWM, WDT LVD, POR, PWM
Number of I/O 30 37
Program Memory Size 8KB (8K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 256 x 8
RAM Size 768 x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 12x8b A/D 12x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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