MC9S08QD4CSC vs MC9S08RD32CDWE

This in-depth comparison of the MC9S08QD4CSC and MC9S08RD32CDWE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08QD4CSC

Freescale Semiconductor

Lifecycle
Active
Stock
5885 PCS
Package
SOIC-8
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08RD32CDWE

NXP USA Inc.

Lifecycle
Active
Stock
3588 PCS
Package
SOIC-28
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08QD4CSC MC9S08RD32CDWE
Supplier - NXP USA Inc.
Series - S08
Part Status Active Obsolete
Core Processor - S08
Core Size - 8-Bit
Speed - 8MHz
Connectivity - SCI
Peripherals - LVD, POR, PWM, WDT
Number of I/O - 23
Program Memory Size - 32KB (32K x 8)
Program Memory Type - FLASH
RAM Size - 2K x 8
Voltage - Supply (Vcc/Vdd) - 1.8V ~ 3.6V
Oscillator Type - Internal
Operating Temperature - -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
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