MCF5208CVM166 vs MCF5213LCVM80

This in-depth comparison of the MCF5213LCVM80 and MCF5208CVM166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5213LCVM80

+BOM

7505 PCS | NXP USA Inc.
MCF5208CVM166

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1212 PCS | NXP USA Inc.
Package BGA-81 MAPBGA-196
Description IC MCU 32BIT 256KB FLSH 81MAPBGA IC MCU 32BIT ROMLESS 196LBGA
Series MCF521x MCF520x
ProductStatus Not For New Designs Active
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 166.67MHz
Connectivity CANbus, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
NumberofI/O 56 50
ProgramMemorySize 256KB (256K x 8) -
ProgramMemoryType FLASH ROMless
RAMSize 32K x 8 16K x 8
Voltage-Supply(Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 3.6V
DataConverters A/D 8x12b -
OscillatorType Internal External
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MCF5213LCVM80 MCF5208CVM166

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