MCF5208CVM166 vs MCF5216CVM66

This in-depth comparison of the MCF5208CVM166 and MCF5216CVM66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5208CVM166

NXP USA Inc.

Lifecycle
Active
Stock
1212 PCS
Package
MAPBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5216CVM66

NXP USA Inc.

Lifecycle
Active
Stock
2628 PCS
Package
BGA-256
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5208CVM166 MCF5216CVM66
Series MCF520x MCF521x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 166.67MHz 66MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART CANbus, EBI/EMI, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 50 142
Program Memory Type ROMless FLASH
RAM Size 16K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V 2.7V ~ 3.6V
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size - 512KB (512K x 8)
Data Converters - A/D 8x12b
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