MCF5216CVM66 vs MCF5208CVM166

This in-depth comparison of the MCF5208CVM166 and MCF5216CVM66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5208CVM166

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1212 PCS | NXP USA Inc.
MCF5216CVM66

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2628 PCS | NXP USA Inc.
Package MAPBGA-196 BGA-256
Description IC MCU 32BIT ROMLESS 196LBGA IC MCU 32B 512KB FLASH 256MAPBGA
Series MCF520x MCF521x
ProductStatus Active Not For New Designs
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 166.67MHz 66MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART CANbus, EBI/EMI, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, LVD, POR, PWM, WDT
NumberofI/O 50 142
ProgramMemoryType ROMless FLASH
RAMSize 16K x 8 64K x 8
Voltage-Supply(Vcc/Vdd) 1.4V ~ 3.6V 2.7V ~ 3.6V
OscillatorType External Internal
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
ProgramMemorySize - 512KB (512K x 8)
DataConverters - A/D 8x12b
Comparison Model : MCF5208CVM166 MCF5216CVM66

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