MCF5208CVM166 vs MCF5272VF66J

This in-depth comparison of the MCF5208CVM166 and MCF5272VF66J provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5208CVM166

NXP USA Inc.

Lifecycle
Active
Stock
1212 PCS
Package
MAPBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5272VF66J

Freescale Semiconductor

Lifecycle
Active
Stock
8019 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5208CVM166 MCF5272VF66J
Supplier - Rochester Electronics, LLC
Series MCF520x MCF527x
Part Status Active Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 166.67MHz 66MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, WDT DMA, WDT
Number of I/O 50 32
Program Memory Size - 16KB (4K x 32)
Program Memory Type ROMless ROM
RAM Size 16K x 8 1K x 32
Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V 3V ~ 3.6V
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
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